2019年智能芯片设计与半导体电路国际会议（ICDSC 2019）
2019 International Conference on Intelligent Chip Design and Semiconductor Circuit(ICDSC 2019)
大会官网：
http://www.engii.org/conference/ICDSC2019/大会时间：2019年1月5-7日
大会地点：中国三亚
在线投稿：
http://www.engii.org/RegistrationSubmission/default.aspx?ConferenceID=1095邮箱投稿：
math.jan@engii.org录用通知：论文投稿后1周左右
△. 会议简介
2019年智能芯片设计与半导体电路国际会议（ICDSC 2019）将于2019年1月5-7日在三亚举行。智能芯片领域的国际竞争已经愈发激烈，高端智能芯片产业即将成为全球争夺半导体产业主导权的契机。此次大会将特邀国内外智能芯片与半导体电路领域内的学者专家前来参会，深度探讨智能芯片、智能传感器、半导体集成电路、深度学习平台等当前技术热点和行业发展前沿。
△.文章出版
所有被会议录用的稿件将会发表在开源期刊并提交知网学术、谷歌学术等。
△.投稿须知：
论文应具有学术或实用价值，未在国内外学术期刊或会议发表过。
论文排版格式以及投稿方式详见网站说明。
审稿流程：本次会议采用先投稿，先送专家评审的方式进行，审稿周期约1周。
△. 大会咨询
联系人：王老师（(Vivian）
邮箱:
math.jan@engii.org QQ: 3025797047
电话: +86-13264702250
△. 本次会议征稿主题但不限于：
AI ChipDesign
og and mixed-signal circuits
og signal processing
Chip-to-chip communications
Circuit technologies
Circuits/devices modeling, verification and testing
Data converters and Data storage
Digital architectures and systems
Digital integrated circuits
Digital/synthesizable voltage regulators and plls
Emerging ic and system
Energy harvesting circuits and systems
Hardware-security circuits
High-bandwidth i/o interfaces
Image sensors and companion chips
Intra-chip communication circuits
Intelligent Chip
Memory design and Memory/ssd controllers
Memory-subsystem enhancements
Mems-based integrated systems
Micro-controllers and Microprocessors
Nano electronics circuits
Power control and management
Processing-in-memory
Processors/ multiprocessors
Reconfigurable architectures & FPGA-based designs
RF integrated circuits and microwave engineering
Sensor interface circuits
Special-purpose digital circuits
Subthreshold and near-threshold circuits
Switched-mode power supplies
System-level power management
Ultrasonic sensors, neural interfaces and closed-loop systems
Wide-bandgap-semiconductor
Wireless sensing, radar and localization
