2017年第三届高分子材料科学国际研讨会（PMS 2017）时间：2017年1月3 -5日
地点：Arnoma Grand Bangkok (曼谷阿诺玛酒店)，泰国
会议简介2017年第三届高分子材料科学国际研讨会（PMS 2017）将于2017年1月3日-5日在泰国曼谷举行。此次会议旨在为高分子材料相关领域的专家、学者提供一个高水平的学术交流平台，以促进该领域的学术交流，实现理论知识和实践经验的及时分享。更多详情请**************会议官网：
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演讲嘉宾• Prof. Aharon Gedanken, Bar-Ilan University
Title: Making the Hospital a Safer Place by the Sonochemical Coating of the Textiles with Antibacterial Nanoparticles
• Dr. Anil Ramdas Bari, North Maharashtra University
Title: Nanostructured ZnO Thin Films For Sensor Applications
• Dr. Avner Rothschild, Technion - Israel Institute of Technology
Title: Reflections on Rust: Iron Oxide Photoelectrodes for Solar Energy Conversion and Storage
• Prof. C. Bor Fuh, National Chi Nan University
Title: Functional Nanoparticles for Biochemical ysis Using Magnetic Immunoassay
• Dr. Chang YANG, Universitat Leipzig
Title: Advances in the development of high performance p-type transparent conducting materials: a study of copper iodide
• Prof. Chun-Yeol You, Inha University, Republic of Korea
• Prof. Harald Justnes, SINTEF Building and Infrastructure
Title: How to Go art with Concrete
• Prof. ILDOO CHUNG, Pusan National University
Title: Biodegaradable nanoporous microspheres by RAFT polymerization
• Prof. Juiming Yeh, Chung Yuan Christian University
Title: Enhancement of gas barrier and electro-catalytic properties of electroactive epoxy resins by incorporation of reduced graphene oxide platelets for anticorrosive coating application
• Dr. Mrinal Pal, CSIR-Central Glass and Ceramic Research Institute
Title: Application of Gas Sensors in Medical Science: Scope and Challenges
• Dr. Togay Ozbakkaloglu, The University of Adelaide
文章出版所有录用的英文文章将被发表在科研出版社（Scientific Research Publishing）旗下的国际开源期刊“Journal of Materials Science and Chemical Engineering" (ISSN: 2327-6045)。该期刊是由同行评议的开源期刊，使您发表的论文得到最广泛的阅览和传播。在线投稿链接：
http://www.engii.org/RegistrationSubmission/default.aspx?ConferenceID=861&utm_source=P2P&utm_campaign=papersubmission&utm_medium=WJJ期待与您相聚泰国曼谷！如果您有任何问题请联系组委会：
联系人：王老师
电话： +86 132 6470 2250
邮箱：
Jenny09157@163.commaterial.jan@engii.org 
